Intel Corp

Quantli Newsdesk

· 2 days ago

TSMC is developing a packaging technology modeled on Intel's EMIB, marking a rare instance of the world's largest contract chipmaker adopting a competitor's approach. Intel's EMIB-T recently achieved a 98% yield rate, matching TSMC's dominant CoWoS method, and has attracted interest from Google, Amazon, and Nvidia. The shift highlights packaging as a critical battleground in AI chip manufacturing.

Quantli Newsdesk

· 7 days ago

TSMC is developing a new chip packaging technology modeled on Intel's EMIB approach, partnering with substrate supplier Kinsus. The move comes as TSMC's dominant CoWoS packaging platform faces capacity constraints with lead times running 52 to 78 weeks. Intel has secured major customers including Google (over 3 million TPUs in 2028) and Amazon, with Nvidia reportedly evaluating EMIB for future GPUs, validating Intel's packaging technology as a credible alternative.

Quantli Newsdesk

· 8 days ago

Intel reported 25% year-over-year revenue growth in Q2 2026-its strongest quarterly performance in over 15 years-driven by a 59% surge in Data Center and AI revenue. However, the company's stock fell sharply due to a $2.1 billion operating loss in its Foundry division and softer Q3 guidance projecting just $0.38 in non-GAAP EPS. A $12.5 billion non-cash CHIPS Act escrow charge resulted in a $2.16 per share GAAP loss.