CtrlK
AVGO
NASDAQ
Semiconductors
$370.83
USD
-$3.63 (-0.97%)
At close: Jul 17, 2026, 4:00 PM EDT
Market Cap:
$1.79T
Volume:
22.9M
Previous Close
$374.45
Day Range
$357.80 - $377.35
52 Week Range
$273.00 - $495.00
Average Volume (10 Days)
23.1M
P/E Ratio (TTM)
60.92
Dividend Yield
0.66%
Broadcom Inc. is a global technology company, which designs, develops, and supplies semiconductors and infrastructure software solutions. The company is headquartered in Palo Alto, California and currently employs 33,000 full-time employees. The company went IPO on 2009-08-06. The firm operates through two segments: semiconductor solutions and infrastructure software. Its semiconductor solutions segment includes all of its product lines and intellectual property (IP) licensing. The company provides a variety of radio frequency semiconductor devices, wireless connectivity solutions, custom touch controllers, and inductive charging solutions for mobile applications. Its infrastructure software segment includes its private and hybrid cloud, application development and delivery, software-defined edge, application networking and security, mainframe, distributed and cybersecurity solutions, and its FC SAN business. The company provides a portfolio of software solutions that enable customers to plan, develop, automate, manage and secure applications across mainframe, distributed, mobile and cloud platforms.
CEO
Mr. Hock Tan
Headquaters
Palo Alto, CALIFORNIA, US
Founded
2009
Employees
33,000
Apollo Global Management and Blackstone anchored a $35 billion financing secured against AI chips, marking the first tranche of Broadcom's AI XPV Platform. The platform aims to deliver over 20 gigawatts of computing capacity through 2028, with the initial capital supporting Anthropic's expansion of more than 1 gigawatt of compute infrastructure starting in mid-2026. This transaction represents one of the largest private financings in AI infrastructure and establishes a new asset-backed lending model for AI compute capacity.
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Broadcom launched a comprehensive edge AI portfolio featuring Wi-Fi 8 solutions, the world's first 50G PON gateway chip, and a joint 5G fixed wireless access platform. The new products integrate neural processing units to enable local AI processing and ultra-low latency connectivity for smart homes and enterprises.
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Third-party endorsement from the AI ecosystem's most influential executive lifts credibility of Marvell's $10B custom chip roadmap and validates the networking layer trade. NVDA holders benefit from confirmation that AI infrastructure spend is broadening beyond GPUs to interconnects and custom silicon.
Broadcom has joined Applied Materials' EPIC platform as an innovation partner to co-develop advanced chip packaging technologies essential for next-generation AI systems. The collaboration will leverage Applied's global innovation centers, including a new Silicon Valley facility, to accelerate R&D and bring cutting-edge AI chip packaging solutions to market faster.
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